2010年2月中国手机芯片行业研究报告(免费)

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【出版时间及名称】：2010年2月中国手机芯片行业研究报告
        【作者】：野村证券
        【文件格式】：PDF
        【页数】：42
        【目录或简介】：

Contents
Executive summary 3
2G handset IC market — intensifying competition 4
2005-09 — MediaTek dramatically changed the competitive landscape 4
Spreadtrum to trigger the competition, Mstar to add more pressure? 5
Forthcoming 3G popularity to lead to further pricing pressure for 2G IC market 7
3G handset IC market — all eyes on TDSCDMA 8
How big was China’s 3G device market in 2009? 8
We expect 3G handset demand to grow tenfold in 2010 9
TDSCDMA handset and handset IC vendors 11
TDSCDMA handset IC vendors — we expect T3G to strengthen its leading
position in 2010 12
About 10mn-unit TDSCDMA handset inventory in the supply chain? 13
We expect TDSCDMA handset IC prices to fall by at least 30-40% in 2010 13
Nokia’s intensifying commitment to TDSCDMA should benefit BYD Electronics 14
The puzzle — how big is the China handset IC market? 15
Nokia’s comments on white-box handset market 15
A market as big as 500-550mn units per year and still growing 16
Latest company views
MediaTek 17
BYD Electronic 33

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关键词：行业研究报告 中国手机 研究报告 行业研究 手机芯片 popularity 研究报告 further market 中国

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